Tae Joo Park, Jeong Hwan Kim, Cheol Seong Hwang, Hyung-Dong Kang, Yeoul-Kyo Chung, and Yong-Soo Oh
“Atomic-layer-deposited dielectric thin films on a Cu clad laminate substrate for embedded metal-insulator-metal capacitors applications in printed circuit boards”
J. Electrochem. Soc. 158(1), G1-G8 (2010) - Nov. (IF=3.662)