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작성일 : 12-05-15 20:11
Tae Joo Park, Jeong Hwan Kim, Cheol Seong Hwang, Hyung-Dong Kang, Yeoul-Kyo Chung, and Yong-Soo Oh “Atomic-layer-deposited dielectric thin films on a Cu clad laminate substrate for embedded metal-insulator-metal capacitors applications in printed circui
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   Atomic-Layer-Deposited Dielectric Thin Films on a Cu Clad Laminate Substrate for Embedded Metal–Insulator–Metal Capacitor Applications in Printed Circuit Boards.pdf (1.8M) [19] DATE : 2012-05-22 20:33:57
Tae Joo Park, Jeong Hwan Kim, Cheol Seong Hwang, Hyung-Dong Kang, Yeoul-Kyo Chung, and Yong-Soo Oh
 
“Atomic-layer-deposited dielectric thin films on a Cu clad laminate substrate for embedded metal-insulator-metal capacitors applications in printed circuit boards”
 
J. Electrochem. Soc. 158(1), G1-G8 (2010) - Nov.       (IF=3.662)